Morning Overview on MSN
MIT’s chip stacking leap could slash energy use for hungry AI chips
Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
Hosted on MSN
This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
Peek inside the package of AMD’s or Nvidia’s most advanced AI products and you’ll find a familiar arrangement: The GPU is flanked on two sides by high-bandwidth memory (HBM), the most advanced memory ...
Add Yahoo as a preferred source to see more of our stories on Google. FILE PHOTO: Nvidia logo is seen on graphic card package in this illustration created on August 19, 2025. REUTERS/Dado ...
YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...
A new digital system allows operations on a chip to run in parallel, so an AI program can arrive at the best possible answer ...
A stacked chip captures, encrypts, and searches image data directly on hardware, combining photodetection, memory, and key generation for secure real-time processing in connected devices. (Nanowerk ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results