Semiconductor Engineering

Overview of ALD-Driven Oxide Semiconductors for High Density, Low Power Memory Architectures (imec, Hanyang Univ.)

A new technical paper titled “Oxide Semiconductor for Advanced Memory Architectures: Atomic Layer Deposition, Key Requirement ...
EDN

The AI-tuned DRAM solutions for edge AI workloads

The evolution of DDR5 and DDR6 represents a inflexion point in AI system architecture, delivering enhanced memory bandwidth, lower latency, and greater scalability.
MarketWatch

The Global Market for Low Power/High Efficiency AI Semiconductors, 2026-2036 - Neuromorphic Computing and In-Memory Architectures Pave the Way for AI Semiconductor Market ...

The "The Global Market for Low Power/High Efficiency AI Semiconductors 2026-2036" has been added to ResearchAndMarkets.com's offering. The market for low power/high efficiency AI semiconductors stands ...
EDN

AI’s insatiable appetite for memory

The biggest challenge posed by AI training is in moving the massive datasets between the memory and processor.
EurekAlert!

Miniaturized, energy efficient, and faster than silicon: this new computer chip is ideal for AI

Artificial intelligence presents a major challenge to conventional computing architecture. In standard models, memory storage and computing take place in different parts of the machine, and data must ...
NextBigFuture

NEO Semiconductor X-HBM Will Have 16X Bandwidth and 10X Memory Density

Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...
insideHPC

Untether AI Unveils At-Memory Compute Architecture at Hot Chips

PALO ALTO — Untether AI, an at-memory computation company for artificial intelligence (AI) workloads, today announced at the HOT CHIPS 2022 conference its next-generation architecture for accelerating ...