AZOM

Die Attach Adhesives Used in Semiconductor Assembly

Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor assembly. Beyond their ability to form a tight bond between die and ...
Electronic Design

Selecting Die Attach Technology for High-Power Applications

High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...
Business Wire

StratEdge White Paper, “Eutectic Die Attach Optimizes High Power GaN Devices,” is Now Available

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and ...
Nature

Die Attach Materials and Sintering Processes in Power Electronics

Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
Business Wire

StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and ...
AZOM

Indium Corporation Introduces Au-Based Precision Die-Attach Preforms

Indium Corporation ® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of ...